Wafer
Your Design.Our Process.Zero Compromises.
A cleanroom cathedral where silicon ingots become the nervous systems of everything that computes, connects, and accelerates. Tolerances measured in angstroms.
Three programs.
One process standard.
Each card expands into full engineering detail — yield curves, Cpk indices, and process cross-sections.
Click + to unlock next clearance levelNexus Inference Systems
N5 Node · 5nm FinFET · 300mm Wafer
Nexus taped out a 420mm² AI inference accelerator targeting datacenter edge deployment. Our DFM team identified 847 marginal geometry violations in the original GDSII; after three ECO cycles, DRC pass rate reached 99.2% — enabling first-lot yields of 71% on a complex 12-metal layer stack.
"Wafer's DFM team found issues our EDA tools missed entirely. The yield ramp was faster than anything we'd seen from our previous foundry partner — by week six we were shipping silicon to customers."
Dr. Priya Venkataraman
VP Silicon Engineering · Nexus Inference Systems
Meridian Automotive OEM
N28 Node · 28nm HV · AEC-Q100 Grade 0
Meridian locked 18-month capacity for a 905nm lidar SoC designed for ADAS Level 4. The 28nm HV node provides the mixed-signal headroom needed for on-chip laser driver integration. All automotive qualification lots are running on a dedicated tool set to guarantee process isolation from consumer-grade work.
"Capacity certainty three years out is not something most fabs will commit to. Wafer signed the MSA before we finalized our vehicle program schedule — that level of partnership is what Level 4 programs require."
James Kowalski
Director, Semiconductor Sourcing · Meridian Group
[PROGRAM REDACTED]
N14 Node · 14nm · ITAR-Compliant Toolset
A classified defense ASIC program requiring full ITAR compliance, domestic toolset audit rights, and quarterly yield reporting to program office. Five engineering lots improved yield from 52% to 86% through systematic defect density reduction on the critical poly layer — driven by our process engineering team embedded in the program.
"Audit rights are non-negotiable for our programs. Wafer's documentation practices and on-site access protocols satisfied both our internal security review and DCSA requirements within 60 days of program kickoff."
Col. (Ret.) Marcus Webb
Program Director · Defense Electronics Division
Seven nodes.
One quality floor.
Cpk ≥ 1.33 is our minimum acceptable process capability. Most layers run above 1.67. You see the data before you sign.
Available Process Nodes
Process Capability Indices (Cpk)
Target Cpk ≥ 1.33N5 node · 12-layer metal stack · Q4 2025 average
Tape-out to wafer out · 300mm FOUP · standard flow
Engineers who ship
on schedule.
The yield data Wafer shared before we signed the MSA was more detailed than post-silicon reports from our previous foundry. That transparency is rare — and it accelerated our technical due diligence by six weeks.
Dr. Priya Venkataraman
VP Silicon Engineering · Nexus Inference Systems
For automotive programs, schedule adherence is not a nice-to-have — a one-week slip cascades into a vehicle program delay. Wafer has never missed a milestone on our lidar SoC. Not one.
James Kowalski
Director, Semiconductor Sourcing · Meridian Automotive Group
The DCSA audit took 60 days. Most fabs take 18 months to get there. Wafer had the documentation infrastructure already in place — it was clear they had built for this customer type from day one.
Col. (Ret.) Marcus Webb
Program Director · Defense Electronics Division
Two paths into
the cleanroom.
Download our PDK and start DRC runs today. Or book a tour and press your face to the cleanroom glass — yellow lithography light and all.
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